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Ever heard the old saw about the guy (gal) that โ€œwent to a fight and a hockey game broke outโ€? Iโ€™d characterize the ongoing debate on the value and longevity of In-Circuit Test (ICT) as a bit of a brawlโ€ฆ
Although it has been in the news for quite a while, one of the methods thought to be the way to extend Mooreโ€™s Law is finally reaching the point where it may be deployed in the near future โ€” 3D Silicon Integrationโ€ฆ
One of the newest IEEE Standards Committees is currently defining the P1838 3D Test Standard. The main goal of P1838 is to develop a โ€œPer Dieโ€ Access Mechanism that becomes a โ€œStacked Dieโ€ Access Mechanism when the individual die are stacked into 3D silicon. Find out moreโ€ฆ
One of our customers was experiencing field returns when 10 Gigabit Ethernet ports started failing to pass traffic at full line rate. How could they test for these failing boards in manufacturing and prevent them from getting out to customers?
Board bring up of an early prototype is one of the most important steps for a design team. The first boards must pass through a battery of tests to demonstrate that the hardware is rock-solid. Non-intrusive technologies can be used to accelerate this process.
With chip-to-chip interconnects now running at 8 GT/s and above, a new class of faults due to manufacturing and process drift is emerging. What are these faults and how are they detected?
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