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OEMs in the telecom industry invest in verifying the performance and conformance of the high-speed interconnects off their gear. Does the same approach apply to chip-to-chip interconnects, and in other industries?
I was reflecting on how much processor speeds, memory, and data transmission rates have increased over the last few decades. And yet the same old tools and techniques are often used to bring up new designs. When do you think we fall off the cliff?
Ever heard the old saw about the guy (gal) that โ€œwent to a fight and a hockey game broke outโ€? Iโ€™d characterize the ongoing debate on the value and longevity of In-Circuit Test (ICT) as a bit of a brawlโ€ฆ
Although it has been in the news for quite a while, one of the methods thought to be the way to extend Mooreโ€™s Law is finally reaching the point where it may be deployed in the near future โ€” 3D Silicon Integrationโ€ฆ
One of the newest IEEE Standards Committees is currently defining the P1838 3D Test Standard. The main goal of P1838 is to develop a โ€œPer Dieโ€ Access Mechanism that becomes a โ€œStacked Dieโ€ Access Mechanism when the individual die are stacked into 3D silicon. Find out moreโ€ฆ
One of our customers was experiencing field returns when 10 Gigabit Ethernet ports started failing to pass traffic at full line rate. How could they test for these failing boards in manufacturing and prevent them from getting out to customers?
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